30 research outputs found

    Application of CMP and wafer bonding for integrating CMOS and MEMS Technology

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    Flexible thin-film acoustic wave devices with off-axis bending characteristics for multisensing applications

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    Flexible surface acoustic wave (SAW) devices have recently attracted tremendous attention for their widespread applications in sensing and microfluidics. However, for these applications, the SAW devices often need to be bent into off-axis deformations between the acoustic-wave propagation direction and bending direction. Currently there are few studies on this topic, and the bending mechanisms under off-axis bending deformations have remained unexplored for multi-sensing applications. Herein, we fabricated aluminum nitride (AlN) flexible SAW devices by using high quality AlN films deposited on flexible glass substrates and systematically investigated their complex deformation behaviors. A theoretical model was firstly developed using coupling wave equations and boundary condition method to analyze the device’s characteristics with bending and off-axis deformation under elastic strains. The relationships between frequency shifts of the SAW device with bending strain and off-axis angle were obtained which showed the identical results with those from the theoretical calculations. Finally, we performed proof-of-concept demonstrations of multi-sensing applications by monitoring human wrist movements at various off-axis angles and detecting UV light intensities on a curved surface, thus paving the ways for versatile flexible electronics applications

    Neuropilin 1 is an entry factor that promotes EBV infection of nasopharyngeal epithelial cells

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    Epstein–Barr virus (EBV) is implicated as an aetiological factor in B lymphomas and nasopharyngeal carcinoma. The mechanisms of cell-free EBV infection of nasopharyngeal epithelial cells remain elusive. EBV glycoprotein B (gB) is the critical fusion protein for infection of both B and epithelial cells, and determines EBV susceptibility of non-B cells. Here we show that neuropilin 1 (NRP1) directly interacts with EBV gB23–431. Either knockdown of NRP1 or pretreatment of EBV with soluble NRP1 suppresses EBV infection. Upregulation of NRP1 by overexpression or EGF treatment enhances EBV infection. However, NRP2, the homologue of NRP1, impairs EBV infection. EBV enters nasopharyngeal epithelial cells through NRP1-facilitated internalization and fusion, and through macropinocytosis and lipid raft-dependent endocytosis. NRP1 partially mediates EBV-activated EGFR/RAS/ERK signalling, and NRP1-dependent receptor tyrosine kinase (RTK) signalling promotes EBV infection. Taken together, NRP1 is identified as an EBV entry factor that cooperatively activates RTK signalling, which subsequently promotes EBV infection in nasopharyngeal epithelial cells

    sj-docx-1-opp-10.1177_10781552221126174 - Supplemental material for Economic burden in patients with anaplastic lymphoma kinase (<i>ALK</i>)-positive non-small cell lung cancer (NSCLC), with or without brain metastases, receiving first-line ALK inhibitors

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    Supplemental material, sj-docx-1-opp-10.1177_10781552221126174 for Economic burden in patients with anaplastic lymphoma kinase (ALK)-positive non-small cell lung cancer (NSCLC), with or without brain metastases, receiving first-line ALK inhibitors by Yanyu Wu, Kaili Ren, Yin Wan and Huamao M Lin in Journal of Oncology Pharmacy Practice</p

    Real-World Treatment Patterns, Outcomes, and Healthcare Resource Utilization in Relapsed or Refractory Multiple Myeloma: Evidence from a Medical Record Review in France

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    Background. Limited data are available from real-world practices in Europe describing prevailing treatment patterns and outcomes in relapsed/refractory multiple myeloma (RRMM), particularly by cytogenetic risk. Methods. A retrospective medical record review was conducted in 200 RRMM patients in France. From first relapse, patients were assessed on second-/third-line treatments, progression-free survival (PFS), overall survival (OS), and healthcare utilization. Results. Fifty-five high risk and 113 standard risk patients were identified. Overall, 192 patients (96%) received second-line therapy after relapse. Lenalidomide-based regimens were most common (>50%) in second line. Hospitalization incidence in high risk patients was approximately twice that of standard risk patients. From Kaplan-Meier estimation, median (95% CI) second-line PFS was 21.4 (17.5, 25.0) months (by high versus standard risk: 10.6 [6.4, 17.0] versus 28.7 [22.1, 37.3] months). Among second-line recipients, 47.4% were deceased at data collection. Median second-line OS was 59.4 (38.8, NE) months (by high versus standard risk: 36.5 [17.4, 50.6] versus 73.6 [66.5, NE] months). Conclusions. The prognostic importance of cytogenetic risk in RRMM was apparent, whereby high (versus standard) risk patients had decidedly shorter PFS and OS. Frequent hospitalizations indicated potentially high costs associated with RRMM, particularly for high risk patients. These findings may inform economic evaluations of RRMM therapies

    Test structures for the characterization of MEMS and CMOS integration technology

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    Test structures have been used to study the feasibility of bonding MEMS to CMOS wafers to create an integrated system. This involves bonding of prefabricated wafers and creating interconnects between the bonded wafers. Bonding of prefabricated wafers has been demonstrated using a chemical-mechanical polishing enabled surface planarization process and an oxygen plasma assisted low temperature wafer bonding process. Two interwafer connection approaches have been evaluated. For an oxide bonding approach, interconnects between wafers are established through contact vias, using a standard multilevel metallization process after the wafer bonding process. Resistances of 3.8-5.2 Ω have been obtained from via chain test structures and an average specific contact resistivity of 1.7 × 10-8 Ωcm2, measured from the single via Kelvin structures. For a direct metal contact approach, electrical connections have been achieved during the bonding anneal stage due to stress relief of the aluminium film.</p
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